01
The GOB process concept
GOB is short for GLUE ON THE BOARD glue, GOB process is a new type of optical thermal conduction nano filling material, through special process will conventional LED display PCB board and patch beads and double fog surface optical processing LED display surface grinding effect, improve the LED display existing protection technology, innovation to realize the display point light source from the surface light source conversion and display. And other fields have a broad market.
02
GOB process to solve the industry pain points
Currently, traditional screens are completely exposed to luminants, with serious defects.
1, low protection level: not moisture-proof, waterproof, dustproof, shock, collision prevention. In the humid climate, easy to appear a large number of dead lights and broken light phenomenon. The lights are easy to drop during the transportation process, and the lights are bad. Also easy to be affected by static electricity, resulting in dead lights.
2, big damage to the eyes: long time watching will cause glare and fatigue, the eyes can not be protected. In addition, there is a "blue damage" effect. Due to the short wavelength and high frequency of blue light LED, human eyes are directly affected by blue light for a long time, which is easy to cause retinopathy.
03
Advantages of the GOB process
1, eight prevention: waterproof, moisture-proof, anti-collision, dust, corrosion, blue light, salt, anti-static.
2. Due to the effect of the frosted surface, the color contrast is also increased, realizing the conversion display from the view point light source to the surface light source, and increasing the visual Angle.
04
Detailed explanation of the GOB process
GOB process truly meets the requirements of LED display product characteristics, and can ensure the quality and standardized mass production of performance. Need complete production process, reliable automatic production equipment with production process development, customize A pair of A mold, and develop packaging materials that meet the requirements of product characteristics.
The GOB process must currently pass six levels, material, fill, thickness, level, surface and maintenance.
(1) Discharge
GOB packaging materials must be customized materials developed in accordance with the process scheme of GOB, and must meet the following characteristics: 1, strong adhesion; 2, strong tension and vertical impact force; 3, hardness; 4, high transparency; 5, temperature resistance; 6, yellow resistance, 7, salt spray resistance, 8, high wear resistance, 9, antistatic, 10, high pressure resistance, etc.;
(2) padding
The GOB packaging process shall ensure that the packaging material completely fills the space between the beads and covers the bead surface, and is firmly attached to the PCB. There should be no bubbles, pinholes, white dots, voids, or bottom fillings. On the bonding surfaces of the PCB and the glue.
(3) Thickness falls off
The consistency of adhesive thickness (accurately described as the consistency of adhesive thickness on the lamp bead surface). After GOB packaging, it is necessary to ensure the uniformity of the adhesive layer thickness of the lamp bead surface. At present, the GOB process has been fully upgraded to 4.0, with almost no thickness tolerance of the rubber layer. The thickness tolerance of the original module is as much as that after the original module. Can even reduce the thickness tolerance of the original modules. Flatness of the joint is perfect!
The consistency of the adhesive layer thickness is very important for the GOB process. If not guaranteed, there will be a series of fatal problems such as modularity, flower screen, uneven splicing, poor color consistency of black screen and light state.happen.
(4) Flat
The surface flatness after GOB packaging should be very good, and there should be no concave, convex and ripple, etc.
(5) Surface falling off
Surface treatment of the GOB containers. At present, the surface treatment in the industry is divided into matte, matte and mirror according to different product characteristics.
(6) Maintenance switch
The repairability of GOB after packaging should ensure that the packaging material can be easy to remove under certain conditions, and the removed part can be filled and repaired after normal maintenance.
05
GOB Process application specification
1. The GOB process supports various LED displays.
Suitable for small spacing LED display, super protective rental LED display, super protective landing interactive LED display, super protective transparent LED display, LED intelligent panel display, LED intelligent billboard display, LED creative display, etc.
2. Due to the support of GOB process, the use range of LED display screen is expanded.
Stage rental, exhibition display, creative display, advertising media, security monitoring, command and dispatch, transportation, sports venues, radio and television, smart city, real estate, enterprises and institutions, special projects, etc.
